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The virtual series of IEEE Women in Engineering International Leadership Conference (WIE ILC) 2020.
The IEEE WIE ILC Virtual Series will take place throughout June 2020,
offering 1-hour sessions, live panel discussions, virtual networking
opportunities, and an on-demand library for you to browse when it’s
convenient for you. Registration is free!
Visit http://ieee-wie-ilc.org/virtual2020/ for more information.
#IEEEWIE
Registration/Ticket URL
Event Website
https://wie.ieeeottawa.ca/event/wie-can-with-ancwt-advancing-new-canadian-women-in-technology/
Abstract:
In this ever-changing world, it’s important to have the support of someone who could help and guide us to advance in our career. Women are great achievers, but due to the systemic bias, many are unable to climb up to leadership positions in their career. Women empowerment is very much needed especially in these tough times and promoting women by providing platforms where they could build themselves is need of the hour. Here in IEEE WIE, we understand its importance and try to provide such platforms especially to the women in our society who lag behind in their learning path because of many reasons and couldn’t come up. IEEE wants every woman to achieve what they desire to be. We promote not only women but also men who understand and go by our notion.
ANCWT (Advancing New Canadian Women in Technology) aim is to help women with technical skills in engineering accomplish their goals by providing an employment bridging program. ANCWT was established in 2016 and has collaborated with multiple employers in the engineering field. Therefore, the IEEE-WIE, Ottawa, and ANCWT have come forward and took an oath, that we will strive hard to make women gain the required knowledge and confidence to overcome this barrier and find themselves in the background of every picture. Join us on 10th August 2020, in a seminar in which Dr. Sawsan Abdul Majid, President of ANCWT accompanied by two alumni of ANCWT, Oyaje Omakwu, and Dalia Elimam will and take us through their journey with ANCWT in Canada.
Speaker Bio:
Dr. Abdul-Majid is a member of the academic community at the faculty of engineering at the University of Ottawa since 2008 as (Researcher, group manager, Part-time professor & graduate student coordinator). She holds a Ph.D. in Optical Communication Systems from Varna University, Bulgaria, and brings more than 25 years of academic (Teaching & Research) experience, as well as eight years of industrial experience and she has more than 45 publications.
Sawsan is a creator and a president of Advancing New Canadian Women in Technology (ANCWT), a Uottawa based employment bridging program. https://ancwt.ca
Her goal is to help newcomer women (immigrants & refugees) who have gained their educations in engineering, IT, and computer science from abroad find their dream jobs in Canada, and settle within the Ottawa community.
Oyaje Omakwu holds a bachelors’ degree in Mechanical Engineering from Nigeria and a masters’ degree in Engineering Management from the University of Ottawa. She has 10 years of experience in project management and business analysis.
She joined ANCWT cohort in 2018, through which she got the opportunity to work as a Project Analyst with the Dept. of Fisheries and Oceans, Canada. It is her desire to help new immigrant women learn about the ANCWT program and its benefits and she is part of the team overseeing ANCWT online activities.
Dalia Elimam, a Chemical Engineer from U.A.E with 16 years of experience in chemical analysis for drinking water pesticides and toxins in food for UAE government. She was introduced to ANCWT in 2019 through the newcomers’ program which guided her to find an entry-level position at Dept. of Fisheries and Oceans- Canada. She is now a Jr. Business Analyst at DFO and work with the client portfolio management team.
IEEE Ottawa Section: MTT-S / AP-S Chapter presents:
Title: Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design
Date: September 2nd, 2020
Time: 11 AM (ET)
Register at: https://events.vtools.ieee.org/m/238482
This talk will review some recent advancements achieved on the characterization and modelling of the trapping effects felt in GaN HEMT transistors, and their impact on microwave circuit design. Because of their nowadays importance, a particular attention will be payed to applications on high power amplifiers for mobile wireless infrastructure and pulsed radar applications.
For that, the talk will start by recollecting the most common model formulations adopted for the various levels of RF engineering, from the device level (physics) to the transistor (circuit) and amplifier (system) level. Starting by the Shockley-Read-Hall capture and emission processes we will be able to understand one of the fundamental signatures of trapping effects, the significantly different charge and discharging time constants, and its impact on power amplifier nonlinear distortion behavior. Then, some widely adopted approaches of the channel current transients’ characterization are addressed and the talk concludes by presenting some illustrative cases of application to RF high power amplifiers.
Speaker: Jose C. Pedro
José C. Pedro received the Diploma, Ph.D., and Habilitation degrees in electronics and telecommunications engineering from the Universidade de Aveiro, Aveiro, Portugal, in 1985, 1993, and 2002, respectively.
He is currently a Full Professor with the Universidade de Aveiro and head of the Aveiro site of the Instituto de Telecomunicações. He has authored 2 books and authored or co-authored more than 200 papers in international journals and symposia. His current research interests include active device modelling and the analysis and design of various nonlinear microwave circuits.
Dr. Pedro was a recipient of various prizes including the 1993 Marconi Young Scientist Award, the 2000 Institution of Electrical Engineers Measurement Prize, the 2015 EuMC Best Paper Microwave Prize, and the Microwave Distinguished Educator Award. He has served the scientific community as a Reviewer and an Editor for several conferences and journals, namely, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, for which he was the Editor-in-Chief.
Venue: Online
Registration: https://www.eventbrite.ca/e/a-brief-introduction-to-ieeextreme-and-wie-hack613-tickets-119203981317
Event Contact Name Ragunath Anbarasu
Event Contact Email: https://wie.ieeeottawa.ca/contact-us/
IEEEXtreme is a worldwide Annual Hackathon, in which teams of IEEE student members participate against each other in a span of 24 hours to solve a set of programming problems. This year IEEEXtreme 14.0 is being held on October 24th. Ragunath Anbarasu, the web master and an active volunteer of IEEE WIE Ottawa has been selected as the Ambassador and Section Lead for the Ottawa region. In this session, he will walk through the IEEEXtreme competition and WIE HACK613, a mock hackathon IEEE WIE Ottawa is organizing as a practice for IEEEXtreme. Register Now! And learn more about the event!
Bio: Ragunath Anbarasu is currently doing his Masters in Electrical and Computer Engineering with Specialization in Data Science at Carleton University. He as been the Web Master of IEEE WIE Ottawa for almost a year and is extremely active in volunteering activities related to IEEE. He has been coordinating with the organizers in hosting this years IEEEXtreme Programming Competition in their respective student branches and supporting Non-IEEE Student Branch Members to get exposure to the Hackathon. He will be extending his help to students looking for support and guidance with information related to IEEEXtreme and connect them to a professional member.
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.
