Events
![ACCELERATING 5G DESIGN INNOVATION THROUGH SIMULATION](https://www.ieeeottawa.ca/wp-content/uploads/2020/06/Slide1-300x169.png)
Presented by the IEEE Ottawa Section MTT-S/AP-S Chapter & Young ProfessionalsÂ
Accelerating 5G Design Innovation Through SimulationÂ
                                  By
Dr. Laila SalmanÂ
                               Ansys Inc.
                     Date: Wednesday, June 10, 2020
                        Time: 2:30 PM – 4:00 PM
                                  Location: Online
           Â
Abstract
5G connectivity is the next technological revolution. This pervasive, ultrafast compute network will connect billions of devices with data on-demand. It will drive economic expansion in many sectors, spawn new products and services, and transform our lives as we know it. Yet, before 5G can deliver on its promises and quality of service (QoS) metrics, wireless systems designers and engineers must overcome sizable challenges. Â
Ansys 5G simulation solutions empower these individuals to solve the complexities impeding device, network and data center design. Ansys 5G simulation solutions provide electromagnetics, semiconductor, electronics cooling and mechanical analysis tools to accurately simulate 5G radio and related technologies. The multi-solution platform leverages high-performance computing that can be deployed across the enterprise, allowing designers and engineering experts to collaborate more effectively.Â
This seminar will highlight the following 5G engineering challenges:Â
·  End User Equipment Â
  o  multi-frequency band antenna integrationÂ
  o   modeling of mm-wave array antennas Â
  o   RFI, EMI & Desense MitigationÂ
·  Base-Station Antenna ModelingÂ
  o  Full Communication Analysis in Electrically Large & Complex EnvironmentÂ
  o  RFI, Data Coverage & ElectroThermal ReliabilityÂ
Speaker Bio
Dr. Laila Salman received the B.S. and M.S. degrees in electronics and communication engineering from Cairo University, Egypt, and the PhD. Degree in electromagnetic and antenna design from the University of Mississippi. She also worked as a post-doctoral student at the Université de Quebec en Outaouais, Gatineau, Canada till 2010. Her research was on dielectric resonator antennas, wearable antennas, microwave and millimeter-wave circuits and systems, microwave imaging for early detection of breast cancer and scattering from left-handed metamaterials. Dr. Salman joined Ansys Canada Ltd. in August 2010 as a Lead Technical Services Specialist for High Frequency Applications.
Registration: Please use the link in the registration section to sign up for the event.
To join event use the following link.
![Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications](https://www.ieeeottawa.ca/wp-content/uploads/2020/09/xiaoxing_gu_photo-220x300.png)
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.
Date and Place: The event will be held online on September 26th and 27th, 2020.
“Every accomplishment starts with the decision to try†~ John F. Kennedy
What?
New to Hackathons? Are you also interested in participating in IEEEXtreme 14.0? IEEE WIE Ottawa presents the first ever Mock Hackathon in Ottawa! Win Exciting Prizes and get experience with us. No need to think of an idea! The questions will be given to you. Our mentors will further help you to get a head start in your hackathon journey! This is a practice event just for you! Learn more about IEEEXtreme here-> https://ieeextreme.org/
When?
September 26th and 27th, 2020
Where?
The event is fully online including the mentorship*.
Agenda
September 26th, 2020
01:00 PM The opening ceremony
02:00 PM Commencement of Hackathon
05:00 PM Final Submission
September 27th, 2020
01:00 PM Results declaration webinar
01:30 PM Prize announcement
02:00 PM The closing ceremony
For More Details Visit: https://wie.ieeeottawa.ca/hack613-the-ottawa-hackathon/