Events
![4th Annual ANSYS Innovation Conference @ Brook Street Hotel | Ottawa | Ontario | Canada](https://www.ieeeottawa.ca/wp-content/uploads/2019/04/Ottawa-ANSYS-4th-Annual-ANSYS-Innovation-Conference-May-2019-300x251.jpg)
Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
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What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
![The Future of Power Electronics: Wide bandgap devices and advanced digital power processors @ Solantro semiconductor corp. | Ottawa | Ontario | Canada](https://www.ieeeottawa.ca/wp-content/uploads/2019/05/PELS-Day-300x209.jpg)
The IEEE Reliability Society & Power Electronics Society Joint Ottawa Chapter and PELS Student Chapter are inviting all interested IEEE members and prospective members to celebrate the 1st PELS Day  with a seminar and tour in Solantro’s labs
Â
The Future of Power Electronics: Â
wide bandgap devices and advanced digital power processors
ByÂ
Tanya Gachovska and Chris Winkler
     Â
DATE:
June 20th, 2019
TIME:
  Refreshments, Registration and Networking: 17:00
  Seminar: 17:30 – 18:30;
  Trip: 18:30 19:30
PLACE:
   Solantro Semiconductor Corp.
  146 Colonnade Rd; Suite 200; Ottawa ON, Canada; K2E 7Y1
Abstract
Wide bandgap semiconductors have drawn a lot of attention in power applications due to their superior material properties, such as withstand to high critical electric field so the breakdown voltage is a minimum of 10X higher and thus can be thinner devices because of the 100 times smaller on-resistance than Si. Their significantly smaller conduction and switching losses compared to Si devices enable high-frequency switching leading to size decrease of the overall system. Smart control of wide bandgap devices, by utilizing advanced digital processors, further benefits power application by enabling designs with low parts count, high power density and a low BOM cost. Also, by supporting variable frequency operation and control methodologies, low EMI/RFI and high efficiency can be achieved. Presented will be some benefits of wide bandgap semiconductors and their control with Solantro’s advanced digital power processor (SA4041) for Smart Power Supplies, and other applications.
After the presentation, a tour showing the Smart Grid project together with Solantro’s Power development, operation and testing labs will be conducted. Solantro engineers will be happy to answer questions during the tour.
Admission
Free: Register by email: ottawapels@gmail.com
Since the event is at
Solantro and the space is limited, only people registered for the event will
be admitted.
Speaker 1: Hisham Abed, P.Eng., Ericsson
Topic:Â Power Integrity – Best design practices
Speaker 2: Dr. Ihsan Erdin, Celestica
Topic:Â Power Integrity Optimization amidst MLCC shortage
Parking:Â Free
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.
Pizza and soft drinks will be served.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Directions:Â Â Â www.fidus.com
![Ottawa L5 Autonomous Vehicle Test Track Tour @ NCC Greenbelt Research Farm | Ottawa | Ontario | Canada](https://www.ieeeottawa.ca/wp-content/uploads/2019/09/L5_track-300x172.png)
Ottawa Life Member Affinity Group presents:Â Ottawa L5, the first integrated Connected & Autonomous Vehicle (CAV) test environment in North America.
The Ottawa L5 private test track is a 1,866 acre, fenced and gated private facility with 16 kilometres of paved roads. The largest secure test facility for CAVs in Canada, the Ottawa L5 private test track creates an ideal proving ground for the safe and productive pre-commercial development, testing, validation and demonstration of CAV technologies. The Ottawa L5 testing facilities are equipped with GPS (RTK), dedicated short range communications (DSRC), Wi-Fi, 4G/LTE and 5G telecommunications and networking infrastructure, making it the first integrated CAV test environment of its kind in North America. Find more information at:Â https://www.investottawa.ca/ottawal5
Tour will last about an hour involving a walk around the site and a group discussion of various technical aspects of the L5 facility. An additional treat is the possibility of an autonomous shuttle ride at the site for some attendees.
Please register in advance with wolfram.lunscher@ieee.org by Friday October 11. Priority will be given to Life members. All members and family are welcome. There is an online liability waiver to be signed. The link will be provided to registrants.