Events
IEEE Ottawa Seminar Series on AI and Machine Learning
IEEE Ottawa Section, PHO
Chapter, CS Chapter, SP Chapter, TEMS Chapter
Jointly with Vitesse
Reskilling
The Rise & Foreseeable Future of
Artificial Intelligence:
Observations from a Commercial Pioneer
Peter MacKinnon
Synergy Technology
Management
—————————————————————-
Wednesday, April 22, 2020
On-line Webinar
112:00 non – 13:30
—————————————————————-
Artificial Intelligence (AI) is constantly in the news
with stories of promise and peril.
Political leaders have declared it a national priority, the global high
tech industry is racing AI apps to markets and policy and governance implications
of AI are in their infancy. We will
explore where this is all heading.
We will begin with some definitions and a bit of
history behind the rise of AI. The talk
will then place AI in the context of being a potentially disruptive technology
on society. This will lead to a discussion about ethics and moral issues
regarding the development and use of aspects of AI as a dual-use
technology. Time permitting, the role of
AI in defence and security will be used as an example for appreciating the complexity
and ethical issues brought on by AI. We will then turn to the role of the
engineer in this new world being enabled by AI.
Finally, we will review potential governance and
policy issues and options to address the rapid unchecked development and
application of AI within society at large; and, ultimately end with a
precautionary note.
Â
Biography
The speaker was
a pioneer in the commercialization of AI in the 1980s and today is actively
involved in ethical and policy issues related to AI. Peter has an extensive background on the
forefront of scientific and technological breakthroughs around disruptive
technologies and their impacts on society.
He was an early proponent in the development and promotion of Big Data
and data analytics using High Performance Computers, and was a major
contributor in creating the Internet in Canada, among other accomplishments.
Peter has a
background as a scientist, business manager, entrepreneur, domestic and
international bureaucrat, executive, diplomat, management advisor, and
academic; including most recently affiliation with both Telfer School of
Management and the Faculty of Engineering at the University of Ottawa and the
Faculty of Engineering at Carleton University.
Peter also blogs on AI for the Institute on Science, Society and Policy,
an interfaculty organisation at uOttawa.
Â
—————————————————————-
Event
is free, but space is limited. All
participants must register in advance. Â
Please
follow the link to register
https://events.vtools.ieee.org/m/226058
—————————————————————-
For more information,
please contact: Kexing Liu kexing.liu@ieee.org
Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
By
Dr. Payam Heydari
University of California, Irvine
Date: Thursday, May 14 , 2020
Time: 12:00 PMÂ – 1 PM
Abstract:
The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology. This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.Â
                                 Speaker Bio:
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers.Â
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.
Â
        Event is free, but space is limited.  All participants must register in advance. For                         Registration: please use the following link
Speaker: Suzanne
Grant of Canadian Advanced Technology Alliance
Topic: #TechnologyNorth – the gold standard
Suzanne envisions a world where a Made in Canada #TechnologyNorth seal is the global gold standard of quality, synonymous with leather shoes Made in Italy, grapes harvested in Champagne, and autos designed and manufactured in Germany. Canada’s world class innovators have delivered excellence decade over decade. Without adequate support of the sector through COVID19, this vision may be a non-starter. During economic difficulties Canada has traditionally bailed out traditional auto and airline industries, and innovative technologies like the AVRO Arrow, Nortel, Research In Motion, Cognos and aspiring young companies were orphaned. By failing to protect our innovators, Canada traded in future traction of Canada’s valuable intellectual property. America, Europe and the Middle East hungry to prosper from our bargain IP and talent came out the winners. Each downturn has taken at least a decade for technology to reinvent itself and rebound.
We have a track record of great beginnings and a more mature Canada can weather the storms and aim for bigger commercial finish lines, where prosperity and job abundance translate to big returns. Before COVID19 struck, we were hitting our stride with record venture investments and sought after talent from leading education institutions. Canada’s Innovation Agenda demonstrated a maturing future view aiming to lead. This is no time to retreat! The government has invested on behalf of Canadians and accountable for a $36B year over year injection into innovation via universities and commercialization. This investment is at risk. Toronto was the fastest growing tech hub in North America with ICT and advanced technologies outpacing job and economic growth rates by almost twice the national average. As we look beyond COVID19, our technology sector, adequately supported through this crisis, can be the catalyst to jump start Canada’s future economy. With a troubled oil and gas sector, Canada will need agile, fast movers doing the heavy lifting to fund our social, health and education programs and rebuild the nation’s balance sheet.
And as we get back to shipping products and services, a more sophisticated approach to sales, branding, advocacy and public relations, layered with Canada’s science, technology, engineering and maths genius can place Canada out in front in multiple lanes. The digitization revolution just got a bump up and opportunities and demand will remain for trillion dollar market frontiers. Data, Internet of things and machine learning are golden. Demand for artificial intelligence, environmental, medical and space solutions will continue to accelerate. Winning the future will take more collaboration, agility, commercial savvy and embracing diverse talent sets and creativity. We’ve got this Canada!
About The Canadian Advanced Technology Alliance
CATA is a trusted industry alliance with a mandate to help Canadian innovation thrive. They focus on commercial capabilities and market access for Canadian HQ small and medium technology businesses. The alliance brings together industry thought leaders with academe and policy makers to advocate for Canadian competitiveness. CATA amplifies a bold, confident podium culture amongst Canadian innovators. CATA recently proposed $3.6B in COVID emergency relief – the Resilience and Rebound Fund for tech small and medium companies.
CATA is home to the National Innovation Leadership Council, and a joint body with the Canadian Association of Chiefs of Police – the CACP/CATA E-Crimes Cyber Council. CATA is launching a President’s Council this Fall
![Clarifying the Path to becoming a Professional Engineer](https://www.ieeeottawa.ca/wp-content/uploads/2020/04/PEO-01-300x300.jpg)
In this time of social distancing, we are pleased to announce that all the team members of IEEE YP and WIE Ottawa Sections are fully committed to providing online interaction and support to our community! In partnership with Professional Engineers Ontario, we present an online talk in “Clarifying the Path to Becoming a Professional Engineer.”
If you are an engineering undergraduate or post-graduate student, or a recent graduate starting out your engineering career, then this seminar might be for you. In it you will learn:
- What is PEO?
- What engineering experience is PEO looking for once I graduate?
- I have international engineering education and experience; how is that evaluated by PEO?
- How is my engineering experience evaluated by PEO?
- How do I prepare my Experience Record?
- What is the PPE?
- What is the EIT Program and the Student Membership Program?
The emphasis of this webinar will be on the P. Eng. licensure process – what PEO is looking for. The webinar will focus on how engineering experience is evaluated and how you can facilitate the process. Learn the dos and don’ts of preparing your licensing application for evaluation.
To participate, you will require: internet connection to view the webinar, phone access to dial into the conference for audio.
We look forward to speaking with you!
![ACCELERATING 5G DESIGN INNOVATION THROUGH SIMULATION](https://www.ieeeottawa.ca/wp-content/uploads/2020/06/Slide1-300x169.png)
Presented by the IEEE Ottawa Section MTT-S/AP-S Chapter & Young ProfessionalsÂ
Accelerating 5G Design Innovation Through SimulationÂ
                                  By
Dr. Laila SalmanÂ
                               Ansys Inc.
                     Date: Wednesday, June 10, 2020
                        Time: 2:30 PM – 4:00 PM
                                  Location: Online
           Â
Abstract
5G connectivity is the next technological revolution. This pervasive, ultrafast compute network will connect billions of devices with data on-demand. It will drive economic expansion in many sectors, spawn new products and services, and transform our lives as we know it. Yet, before 5G can deliver on its promises and quality of service (QoS) metrics, wireless systems designers and engineers must overcome sizable challenges. Â
Ansys 5G simulation solutions empower these individuals to solve the complexities impeding device, network and data center design. Ansys 5G simulation solutions provide electromagnetics, semiconductor, electronics cooling and mechanical analysis tools to accurately simulate 5G radio and related technologies. The multi-solution platform leverages high-performance computing that can be deployed across the enterprise, allowing designers and engineering experts to collaborate more effectively.Â
This seminar will highlight the following 5G engineering challenges:Â
·  End User Equipment Â
  o  multi-frequency band antenna integrationÂ
  o   modeling of mm-wave array antennas Â
  o   RFI, EMI & Desense MitigationÂ
·  Base-Station Antenna ModelingÂ
  o  Full Communication Analysis in Electrically Large & Complex EnvironmentÂ
  o  RFI, Data Coverage & ElectroThermal ReliabilityÂ
Speaker Bio
Dr. Laila Salman received the B.S. and M.S. degrees in electronics and communication engineering from Cairo University, Egypt, and the PhD. Degree in electromagnetic and antenna design from the University of Mississippi. She also worked as a post-doctoral student at the Université de Quebec en Outaouais, Gatineau, Canada till 2010. Her research was on dielectric resonator antennas, wearable antennas, microwave and millimeter-wave circuits and systems, microwave imaging for early detection of breast cancer and scattering from left-handed metamaterials. Dr. Salman joined Ansys Canada Ltd. in August 2010 as a Lead Technical Services Specialist for High Frequency Applications.
Registration: Please use the link in the registration section to sign up for the event.
To join event use the following link.