Events
![Modern Day Applications of Power Electronics – Who Can Benefit?](https://www.ieeeottawa.ca/wp-content/uploads/2019/11/28Nov-2019-300x192.jpg)
Abstract – Application of power electronics is widespread in everyday
life. Some applications are considered as “nice to have it;†in other cases,
they are essential. This presentation discusses a wide variety of daily-used
applications around the world. Also covered is an advanced topic, such as SMART
Controller that today’s grid requires for voltage regulation, power factor
regulation, unbalance voltage/current regulation, harmonic elimination and so
on. A SMART Controller that is based on functional requirements and
cost-effective solutions is derived from utilizing the best features of all the
technical concepts that are developed until now. Final year students of
electrical engineering undergraduate curriculum, post graduate students,
researchers, academicians and utility engineers will benefit from attending
this course. The participants will hear from an expert who actually designed
and commissioned a few utility-grade SMART controllers since their inception in
the 1990s.
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Speaker’s
Bio
Kalyan Sen, a
Fulbright Scholar, is the Chief Technology Officer of Sen Engineering
Solutions, Inc. (www.sentransformer.com) that specializes in
developing SMART power flow controllers—a functional requirements-based and
cost-effective solution. He received
BEE,
MSEE, and PhD degrees, all in Electrical Engineering, from Jadavpur University,
India, Tuskegee University, USA, and Worcester Polytechnic Institute, USA,
respectively. He also received an MBA from Robert Morris University, USA.
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Dr.
Sen spent more than 30 years in academia and industry and became a Westinghouse
Fellow Engineer. He was a key member of the Flexible Alternating Current
Transmission Systems (FACTS) development team at the Westinghouse Science &
Technology Center in Pittsburgh. He contributed in all aspects (conception,
simulation, design, and commissioning) of FACTS projects at Westinghouse. He
conceived some of the basic concepts in FACTS technology. He has authored or
coauthored more than 25 peer-reviewed publications, 8 issued patents, a book
and 4 book chapters in the areas of FACTS and power electronics. He is the
coauthor of the book titled, Introduction
to FACTS Controllers: Theory, Modeling, and Applications, IEEE Press and
John Wiley & Sons, Inc. 2009, which is also published in Chinese and Indian
paperback editions. He is the co-inventor of Sen Transformer.
![A Brief Introduction to IEEEXtreme and WIE HACK613](https://www.ieeeottawa.ca/wp-content/uploads/2020/09/thumbnail_6B324109B94F42B29AC1F48B24D33F20-300x150.jpg)
Venue: Online
Registration: https://www.eventbrite.ca/e/a-brief-introduction-to-ieeextreme-and-wie-hack613-tickets-119203981317
Event Contact Name Ragunath Anbarasu
Event Contact Email: https://wie.ieeeottawa.ca/contact-us/
IEEEXtreme is a worldwide Annual Hackathon, in which teams of IEEE student members participate against each other in a span of 24 hours to solve a set of programming problems. This year IEEEXtreme 14.0 is being held on October 24th. Ragunath Anbarasu, the web master and an active volunteer of IEEE WIE Ottawa has been selected as the Ambassador and Section Lead for the Ottawa region. In this session, he will walk through the IEEEXtreme competition and WIE HACK613, a mock hackathon IEEE WIE Ottawa is organizing as a practice for IEEEXtreme. Register Now! And learn more about the event!
Bio: Ragunath Anbarasu is currently doing his Masters in Electrical and Computer Engineering with Specialization in Data Science at Carleton University. He as been the Web Master of IEEE WIE Ottawa for almost a year and is extremely active in volunteering activities related to IEEE. He has been coordinating with the organizers in hosting this years IEEEXtreme Programming Competition in their respective student branches and supporting Non-IEEE Student Branch Members to get exposure to the Hackathon. He will be extending his help to students looking for support and guidance with information related to IEEEXtreme and connect them to a professional member.
![Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications](https://www.ieeeottawa.ca/wp-content/uploads/2020/09/xiaoxing_gu_photo-220x300.png)
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.
![Antenna Arrays Seminar](https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas-225x300.png)
Date: October 7th 2020
Time: 5:00 – 6:30 pm EDT
Venue: Online – http://bit.ly/DJKYPAAS
Event Contact: Daniel J King (danieljamesking3@gmail.com)
IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:
- A basic introduction to the theory and practice of antenna arrays;
- Information about current research opportunities and applications;
- Specific examples in mm-Wave applications!
Register today to this virtual event!
More info here: https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas.pdf